Ultrasonic Joining of Si_3N_4 Plates at 19 kHz Using Al, Cu and Ni Plates as Insert Metal
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概要
- 論文の詳細を見る
Ultrasonic joining of ceramic plates using the lateral face of a rod vibrating longitudinally at 19 kHz was studied. We joined two 2-mm-thick silicon nitride (Si_3N_4) plates with an insert metal plate sandwiched between the Si_3N_4 plates. The insert metal has a high melting point so that the joint is resistant to high temperatures. The insert metals that we used were Al, Cu and Ni. The joining tool was a straight bar vibrating longitudinally at 19 kHz. The lateral face of the bar was vigorously rubbed against the ceramic plate and the resultant increase in temperature was high enough to enable joining of the plates. The joining, which was acomplished in 3-5 s, was performed without any surface pretreatment.
- 社団法人応用物理学会の論文
- 1999-10-15
著者
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Watanabe Yuji
Department Of Electrical Engineering Faculty Of Engineering Tohoku University
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Okamura Naoyuki
Department of Electronics and Systems, Faculty of Engineering, Takushoku University
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Watanabe Yuji
Department Of Computational Science And Engineering Graduate School Of Engineering Nagoya University
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Okamura Naoyuki
Department Of Electronics And Systems Faculty Of Engineering Takushoku University
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