Ultrasonic Joining of Silicon Nitride Plates Without an Adhesive Material Using a 19 kHz Vibration System
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概要
- 論文の詳細を見る
In recent years, we have attempted ultrasonic ceramic joining for the purpose of extending the application field of ultrasonic joining. By devising a vibration system, the authors have attempted ceramic ultrasonic joining by which a metal becomes an intermediate material. In this method, however, the high temperature resistance and strength of the joint are dependent on the melting point and strength of the metallic material. Therefore, in this study, we attempted ultrasonic joining of silicon nitride (Si3N4) plates without using any intermediate material. The experimental result showed that ultrasonic joining was possible without using the intermediate material. The maximum joint strength was 33 MPa and the joining time required was about 10 s.
- Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
- 2001-05-30
著者
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Watanabe Yuji
Department Of Electrical Engineering Faculty Of Engineering Tohoku University
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Iijima Mitsuo
Department Of Electronics And Systems Faculty Of Engineering Takushoku University
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Watanabe Yuji
Department Of Computational Science And Engineering Graduate School Of Engineering Nagoya University
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