A Cascade Open-Short-Thru (COST) De-Embedding Method for Microwave On-Wafer Characterization and Automatic Measurement(<Special Section>Microelectronic Test Structures)
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概要
- 論文の詳細を見る
In this study, a cascade open-short-thru (COST) de-embedding procedure is proposed for the first time for on-wafer device characterization in the RF/microwave frequency regime. This technique utilizes the "open" and "short" dummy structures to de-embed the probe-pad parasitics of a device-under-test (DUT). Furthermore, to accurately estimate the input/output interconnect parasitics, including the resistive, inductive, capacitive, and conductive components, the "thru" dummy device has been characterized after probe-pad de-embedding. With the combination of transmission-line theory and cascade-configuration concept, this method can efficiently generate the scalable and repeatable interconnect parameters to completely eliminate the redundant parasitics of the active/passive DUTs of various device sizes and interconnect dimensions. Consequently, this method is very suitable for the on-wafer automatic measurement.
- 社団法人電子情報通信学会の論文
- 2005-05-01
著者
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HUANG Guo
National Nano Devices Laboratories
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CHEN Kun
National Nano Devices Laboratories
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Teng Yu
National Nano Device Laboratories
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Huang Guo
National Nano Device Laboratories
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Chen Kun
National Nano Device Laboratories
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Cho Ming-hsiang
Department Of Communication Engineering National Chiao-tung University
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Cho Ming
National Nano Device Laboratories
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Chen Kun‐ming
National Nano Device Laboratories
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CHIU Chia
National Nano Device Laboratories
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PENG An
National Nano Device Laboratories
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