錯形成及び配位子置換の反応場としての荷電ミセル界面

概要

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The kinetics has been investigated for the complexation between copper (II) and PAN in the presence of micelle ions. The complexation rate depends on the concentration of the surfactant in solutions containing micelle ions formed from tetradecyl dimethyl benzyl ammonium chloride. Solubilized PAN exists in the neighborhood of the charged micelle surface, to which the chelating group of some ligands is directed. Such ligand was found to be difficult to react with copper(II) from the dependence of the kinetic constants of complexation on quaternary ammonium salt concentration. The rate constant for the ligand substitution reaction between the copper(II) complex with PAN and EDTA is 2.2×10^3 M^<-1> s^<-1>{(25.0±0.1)℃} in the presence of 1.56×10^<-2> M quaternary ammonium chloride, which is useful in complexometric titrations using sparingly soluble metal indicators. In addition, the influence of dodecyl sulfate ion on the rates of complexation and ligand substitution reactions was investigated. The rate of a chemical reaction between species having different signs of charge is much larger than that of a reaction between species having the same sign. These results indicate the important contribution of the electrostatic effect of micelles to the rates of ionic reactions on the charged micelle surface.
社団法人日本分析化学会の論文
1976-05-10