312 点接触共振法による CSP の非破壊検査 : RUS /レーザー計測と共振モード解析

概要

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Resonance ultrasound spectroscopy (RUS) was studied with the purpose of developing an on-line inspection technique of disbonding in the chip scale package (CSP) assemblies an important miniature semiconductor package consisting of silicon monocrystal, ceramic base, and plastic thin layer between them. We put the CSP on three pins, two pinducers and one supporting pin, and measured the resonance frequencies by driving one pinducer with sinusoidal waves and detecting the oscillation amplitude through the other pinducer. Only the CSP mass (^∿0.4g) contributed to the ultrasonic-vibration transmission and reception, and neither coupling agent nor external load was necessary. The resonance frequencies decrease with disbonding, depending on the antinodes relative to the damage location.
2002-10-10