超音波ワイヤボンダでのワークの真空吸着固定力に関する研究

概要

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In an assembling process of semiconductor devices, many kinds of ultrasonic wire bonders are generally used. In these machines, works are usually placed on a plate with small vacuum suction hole(s) to hold the works against ultrasonic bonding vibration. In terms of bonding condition, bonding points are required to be fixed firm enough to avoid miss bonding. This study was carried out to estimate the holding force of the vacuum suction methods. Some equations were derived to calculate the suction force and the friction moment of a work placed on a plate with a circular or rectangular vacuum hole under and assumed linear pressure distribution. Furthermore basing upon the Reynolds equation, some negative pressure distributions and the holding force of a work were calculated by the FEM. These results were compared, and an approximate correction function was found for the expressions derived. These results were proved to be valid from experiments.
一般社団法人日本機械学会の論文
2000-09-25