The Behavior of Fatigue Cracks in Pure Iron Subjected to Rotary Bending and Cyclic Torsion : 1st Report, Stress-Concentration Factor and Fatigue-Notch Factor due to Fatigue Cracks
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概要
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In order to examine the behavior of fatigue cracks in pure iron subjected to rotary bending and cyclic torsion, the copper electroplating method of stress analysis and slip phenomena in the material was applied. The charge in metal properties caused by fatigue cracks had no effect on the propagating stress of cracks. The difference of the fatigue-notch factor between bending and torsion was due to that of both the strain-concentration factor and the strain gradient at crack tips. It was found that in torsion the fatigue cracks propagated when the cyclic shear stress over one grain reached cracks depended on the tensile stress exerted over more than one grain size.
- 一般社団法人日本機械学会の論文
著者
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Seika Masaichiro
Faculty Of Engineering Nagoya University
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Kitaoka Seiichiro
Faculty Of Engineering Nagoya University
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KO Haeng-Nam
Faculty of Engineering, Nagoya University.
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Ko Haeng-nam
Faculty Of Engineering Nagoya University
関連論文
- Basic Research on Slip-initiation Phenomenon by Fatigue and Its Application to Stress Measurement
- Examination of the Condition on the Threshold of Propagation of Fatigue Cracks Using Slip-initiation Phenomena : 1st Report, Behaviour of Crack Opening or Closing and Crack Opening Stress
- Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 3rd Report, Application of a Sulfamate Bath
- On the Temperature- and cyclic speed-dependence of the Method of Stress Measurement Using Iron-foils
- Stress Measurement Using Slip-initiation Phenomenon in Iron Foil
- Basic Study on Stress Measurement Using Slip-initiation Phenomenon in Electro-deposited Iron
- Experimental Evaluation of the Stress Intensity Factor Using the Phenomena of Grain Growth and Slip-initiation in Copper Foil
- Measurement of Cyclis Stresses Caused in High Temperature Range by Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating
- Basic Study on Foil Strain Gauges Made of Electrodeposited Copper or Nickel
- Fundamental Studies on the Copper and Nickel Electroplating Methods of Stress Analysis : Effects of the Ground Plating on the Proper Stress
- Dependence of the Threshold Stress of Microcrack Propagation on the Stress Ratio
- The Effect of Crack Closure on the Threshold of Micro Fatigue Crack Propagation under Mixed Mode
- Photoelastic Study of Stresses in a Cylindrical Pressure Vessel with a Nozzle : 1st Report, Flush Type Nozzle
- Measurement of Stress Concentrations in Threaded Connections
- Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 2nd Report, Examination of Applicable Temperature and Accuracy of Measured Values
- Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 1st Report, Plating Conditions and Calibration Tests
- Fundamental Study on a Foil Strain Gauge of Electrodeposited Nickel
- On the Understressing Effect of the Eutectoid Steel
- A Study on the Improvement in Sensitivity of Strain Gauges Made of Copper Electrodeposited Foil
- Examination of the Threshold Condition for Propagation of Fatigue Cracks Using Slip-initiation Phenomena : 3rd Report, In the Case of Aged Cracked Specimen
- The Threshold of Micro Crack Propagation under Mixed Mode
- Measurement of Biaxial Stress Using Electrodeposited Copper Foil with a Microcircular Hole : Method Using the Probability of the Occurrence of Slip
- The Behavior of Fatigue Cracks in Pure Iron Subjected to Rotary Bending and Cyclic Torsion : 2nd Report, Effect of Crystal Grain Size
- The Behavior of Fatigue Cracks in Pure Iron Subjected to Rotary Bending and Cyclic Torsion : 1st Report, Stress-Concentration Factor and Fatigue-Notch Factor due to Fatigue Cracks
- On the Understressing Effect of the Eutectoid Steel at -60℃
- On the Stress Measurement Method Using Grain Growth Process of Electrodeposited Copper Foil : 1st Report, Grain Nucleation and Grain Growth : Series A : Solid-Mechanics, Strength of Materials
- On the Stress Measurement Method Using Slip Lines in Copper Foil with Grown Grain Structure : Solid-Mechanics, Strength of Materials
- The Propagation Behaviour of Mode I Surface Cracks under Biaxial Stresses by the Combination of Plane Bending and Cyclic Torsion
- The Propagation Threshold of a Through Crack in a Plate Under the Mixed Mode : (Plane Bending and Cyclic Torsion)
- Change of Material Properties at the Tips of Fatigue Cracks Subjected to Macroscopic Tensile and Shear Stresses for Propagation : in Rotary Bending and Cyclic Torsion
- Photoelastic Investigation of the Maximum Stress in a Plate with a Reinforced Circular Hole under Tension
- Examination of the Adaptability of the Copper Electroplating Method of Stress Analysis to the Low Temperature Range