Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 1st Report, Plating Conditions and Calibration Tests
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概要
- 論文の詳細を見る
By using an electroplated nickel, a fundamental research for measurement of cyclic stresses in high temperature range is carried out. The plating used consists of two layers, namely, a preliminary deposit of alkaline copper in a copper cyanide bath and a dull nickel deposit in a Watts bath. It is suitable for the present purpose that the current density of nickel deposits is taken to be below 0.5 mA/mm^2. In the high temperature range up to 200℃, grains of deposited nickel grow large when the deposits are subjected to a cyclic shearing strain of more than a certain magnitude. As a result of examination of the relation between the shearing strain with which grains begin to grow and the number of cycles, it is found under the plating conditions tested that the available testing temperature for the method is within the range of 100 〜230 ℃.
- 一般社団法人日本機械学会の論文
著者
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SEIKA Masaichiro
Faculty of Engineering,Nagoya University
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Hosono Kikuo
Faculty Of Engineering Nagoya University
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OHARA Hisanobu
The Chubu Electric Power Inc.
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KATO Akira
Graduate Student, Chubu Institute of Technology
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Seika Masaichiro
Faculty Of Engineering Nagoya University
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Kato Akira
Graduate Student Chubu Institute Of Technology
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HOSONO Kikuo
Faculty of Engineering, Nagoya University
関連論文
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- Basic Study on Foil Strain Gauges Made of Electrodeposited Copper or Nickel
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- Examination of Fatigue Failure of Metals by Means of Electro-Plating Method
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- The Threshold of Micro Crack Propagation under Mixed Mode
- The Behavior of Fatigue Cracks in Pure Iron Subjected to Rotary Bending and Cyclic Torsion : 2nd Report, Effect of Crystal Grain Size
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- Change of Material Properties at the Tips of Fatigue Cracks Subjected to Macroscopic Tensile and Shear Stresses for Propagation : in Rotary Bending and Cyclic Torsion
- Photoelastic Investigation of the Maximum Stress in a Plate with a Reinforced Circular Hole under Tension
- Examination of the Adaptability of the Copper Electroplating Method of Stress Analysis to the Low Temperature Range