Examination of the Adaptability of the Copper Electroplating Method of Stress Analysis to the Low Temperature Range

概要

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In order to examine the adaptability of the copper electroplating method to low temperatures, alternating torsion tests are made at temperatures between room temperature and -80℃. The specimens tested are cooled by vapourized liquid nitrogen. The relation between the limiting value of shearing strain which causes grain-growth in the deposited copper and the testing temperature is investigated, and the temperature range favourable for application of the method is studied. It is found that the present method has the same reliability at low temperatures as at room temperature. In the vicinity of -80℃, however, the limiting value of shearing strain is too high and the initial grown grains in the deposited copper become extremely fine, giving unavoidable errors in the measured values. It is concluded that the present method may be used down to -50℃ in practice.
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