Kitaoka Seiichiro | Faculty Of Engineering Nagoya University

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概要

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著作論文

Basic Research on Slip-initiation Phenomenon by Fatigue and Its Application to Stress Measurement
Examination of the Condition on the Threshold of Propagation of Fatigue Cracks Using Slip-initiation Phenomena : 1st Report, Behaviour of Crack Opening or Closing and Crack Opening Stress
On the Temperature- and cyclic speed-dependence of the Method of Stress Measurement Using Iron-foils
Stress Measurement Using Slip-initiation Phenomenon in Iron Foil
Basic Study on Stress Measurement Using Slip-initiation Phenomenon in Electro-deposited Iron
Experimental Evaluation of the Stress Intensity Factor Using the Phenomena of Grain Growth and Slip-initiation in Copper Foil
Dependence of the Threshold Stress of Microcrack Propagation on the Stress Ratio
The Effect of Crack Closure on the Threshold of Micro Fatigue Crack Propagation under Mixed Mode
On the Understressing Effect of the Eutectoid Steel
A Study on the Improvement in Sensitivity of Strain Gauges Made of Copper Electrodeposited Foil
Examination of the Threshold Condition for Propagation of Fatigue Cracks Using Slip-initiation Phenomena : 3rd Report, In the Case of Aged Cracked Specimen
The Threshold of Micro Crack Propagation under Mixed Mode
Measurement of Biaxial Stress Using Electrodeposited Copper Foil with a Microcircular Hole : Method Using the Probability of the Occurrence of Slip
The Behavior of Fatigue Cracks in Pure Iron Subjected to Rotary Bending and Cyclic Torsion : 2nd Report, Effect of Crystal Grain Size
The Behavior of Fatigue Cracks in Pure Iron Subjected to Rotary Bending and Cyclic Torsion : 1st Report, Stress-Concentration Factor and Fatigue-Notch Factor due to Fatigue Cracks
On the Understressing Effect of the Eutectoid Steel at -60℃
On the Stress Measurement Method Using Grain Growth Process of Electrodeposited Copper Foil : 1st Report, Grain Nucleation and Grain Growth : Series A : Solid-Mechanics, Strength of Materials
On the Stress Measurement Method Using Slip Lines in Copper Foil with Grown Grain Structure : Solid-Mechanics, Strength of Materials
The Propagation Behaviour of Mode I Surface Cracks under Biaxial Stresses by the Combination of Plane Bending and Cyclic Torsion
The Propagation Threshold of a Through Crack in a Plate Under the Mixed Mode : (Plane Bending and Cyclic Torsion)
Change of Material Properties at the Tips of Fatigue Cracks Subjected to Macroscopic Tensile and Shear Stresses for Propagation : in Rotary Bending and Cyclic Torsion

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