レジンボンドCBN砥石の目直しに関する研究(第1報) : 砥石作業面の生成過程

概要

論文の詳細を見る
In this report, the working surface just after dressing the resin bond CBN wheel was examined by observing the behavior of abrasive grain and measuring the cutting edge distribution in dressing process for several conditions by means of WA stick methods. The main conclusions obtained are as follows : (1) The chip pocket is gradually produced in dressing process. Instantaneously, the breakage and the release from bond of CBN grain occur and the new grain appears from within bond. The percent of the release grain and the new appearance grain differs with each dressing condition. (2) The average depth of chip pocket increases with the increase of the consumption of WA stick and tends to finally coverage to a constant value. (3) The cutting edge distribution becomes coarser for more consumption of WA stick and heavier dressing condition. (4) The cutting edge distribution becomes closer by executing the re-truing operation just after dressing. By using the close cutting edge distribution can be adjusted over a wide range by controlling the conditions of dressing and re-truing.
公益社団法人精密工学会の論文
1989-06-05