レジンボンドCBN砥石の目直しに関する研究(第2報) : WAスティックによる結合剤の除去過程

概要

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This paper deals with the bond removal process in the dressing of resin bond CBN wheel by means of WA stick method. The bond removal process was investigated by observing the wheel surface, and measuring the topography of wheel surface with profilometer and processing graphically the results by computer. The bond removal is considered to be mainly caused by the rolling and cutting operation of the loose WA grains cut by CBN wheel. The bond removal rate changes with the location on the wheel surface. As the result, the depth of chip-pocket and the cutting edge spacings on the wheel surface become unevenly with the location on the wheel surface. A number of shallow and narrow grooves made with the constant interval in the spindle axial direction on the wheel surface reduces the uneven magnitude of the depth of chip-pocket and the cutting edge spacings.
公益社団法人精密工学会の論文
1989-10-05