光モジュール実装基板における薄膜電極の付着力評価

概要

論文の詳細を見る
We use scratch-tests to measure the adhesion force of gold/platinurn/titanium thin-film electrodes patterned on p]anar-lightwave-circuit devices of optical modules. In the patterning process, a sacrificial copper layer is deposited by vacuum evaporation, and the thin-film electrodes are patterned both on Si0_2 over glass layers and on deep pits. A microscratch tester is used to measure the adhesion force between the Si0_2 over glass layer and the thin-film electrodes : the critical load is 157.7 mN (16.08 gf) and the shear stress is 1.36 GPa. Energy-dispersive X-ray spectroscopy (EDX) of the scratch surfaces of the thin-film electrodes reveals that the peeling interface of the thin-film electrodes is the interface between the gold layer and the platinum layer. Moreover, a depth profile of the thin-film electrodes by Auger electron spectroscopy (AES) shows that there is no carbon contamination in the thin-film electrodes, no oxide layer, and no copper contamination between the titanium layer and the Si0_2 over glass layer.
公益社団法人精密工学会の論文
2000-07-05