低融点ろう材によるダイヤモンド砥粒固定ワイヤーソーの試作とこれを用いた単結晶シリコンのスライス加工

概要

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Existing methods for slicing hard and brittle materials such as silicon use loose abrasives or fixed abrasive wire of which abrasives are adhered onto wire by resinoid bond or electroplating bond. Authors made an experiment to adhere abrasives onto high-tensile-strength SUS304 wire using low melting temperature brazing filler metal. The results were as follows.1. Surface of diamond abrasives were modified by coating thin layers of TiC and Ni-P followed by heat treatment at 1173 K. Wettability with brazing filler metal and adhesive strength were improved.2. By drawing SUS304 wire upward through vertically connected two crucibles of molten brazing filler metal and diamond abrasives, we successfully made the fixed abrasive diamond wire saw.3. We converted a loose abrasive cutting machine into a fixed abrasive multi wire saw. Using this machine, we sliced single-crystal silicon and obtained desired results.
社団法人粉体粉末冶金協会の論文
2009-11-15