無電解めっきとレーザー照射による有機樹脂板上へのCuマイクロパターン形成

概要

論文の詳細を見る
Printed circuit board with a Cu fine pattern was fabricated by electroless plating and laser irradiation. A glass fiber-reinforced epoxy resin plate was immersed in a Pd2+ containing solution, and then Cu metal layer was deposited on the epoxy resin by Cu electroless plating. After Cu plating, the Cu deposited specimen was irradiated with a pulsed Nd-YAG laser in air or doubly distilled water through an iris diaphragm and a convex lens to remove the Cu layer locally. The width of the Cu removed area in creased with increasing laser power and with decreasing scanning rate of the laser beam. In the case of laser irradiation in doubly distilled water, the Cu layer around the laser irradiated-area was rolled up to form less precise patterns. Fine Cu-pattern coils with 60μm width and 20μm intervals were fabricated on the epoxy resin by laser irradiation in air.
表面技術協会の論文
2008-08-01