エアロゾルデポジションによる高周波キャパシタ膜の形成とその応用

概要

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Miniaturization, cost reduction and higher performance in RF wireless communication products are demanded for constructing a ubiquitous computing network system. To fulfill these demands, we propose an organic built-up circuit board with various embedded passive ceramic component films for the next-generation RF modules. In the circuit board we propose, ceramic films have to be built-up on a resin substrate at a temperature lower than the endurance temperature of the resin. Our novel aerosol deposition (ASD) method through the use of accelerated ceramic nano-particle bombardment is therefore one of the most effective deposition methods for the ceramic film. We describe a novel ASD approach to fabricate embedded capacitors on organic flame retardant type 4 (FR-4) substrates and the correlation between the microstructure and dielectric properties of ASD dielectric films deposited under various conditions. We also confirmed the formation of dense BaTiO3 dielectric films on organic substrates at room temperature. Embedded capacitors on an FR-4 substrate, fabricated as a prototype with this ASD film, had a capacitance density of 300 nF/cm2.
日本エアロゾル学会の論文
2007-03-20