Impact of Self-Aligned Metal Capping Method on Submicron Copper Interconnections

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2004-05-15

著者

• Imai Toshinori

  Device Development Center Hitachi Ltd.

• NOGUCHI Junji

  Device Development Center, Hitachi Ltd.

• Ito Yuko

  Device Development Center, Hitachi, Ltd.

• SAITO Tatsuyuki

  Device Development Center, Hitachi Ltd.

• Kubo Maki

  Device Development Center Hitachi Ltd.

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• Influence of Cu-Ion Migration and Fine-Line Effect on Time-Dependent Dielectric Breakdown Lifetime of Cu Interconnects
• Impact of Self-Aligned Metal Capping Method on Submicron Copper Interconnections
• Impact of Self-Aligned Metal Capping Method on Submicron Copper Interconnections

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