Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-10-15
著者
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Tomita Yoshihiro
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
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Tanaka Naotaka
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
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TAKAHASHI Kenji
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
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MORIFUJI Tadahiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
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Umemoto Mitsuo
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
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TANIDA Kazumasa
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
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KAJIWARA Ryoichi
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
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ANDO Tatsuya
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
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- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20μm Pitch
- Fabrication of High-Density Wiring Interposer for 10GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
- Micro Cu Bump Interconnection on 3D Chip Stacking Technology
- Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 μm Pitch
- Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
- Current Status of Research and Development for Three-Dimensional Chip Stack Technology