Fabrication of High-Density Wiring Interposer for 10GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-07-15
著者
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Jung E‐s
Nanoelectronics Research Institute (neri) National Institute Of Advanced Industrial Science And Tech
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Umemoto Mitsuo
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
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Tokoro Kazuhiko
Nanoelectronics Research Institute (neri) National Institute Of Advanced Industrial Science And Tech
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KIKUCHI Katsuya
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Tec
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SEGAWA Shigemasa
PI Research and Development Co., Ltd.
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JUNG Eun-Sil
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Tec
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NEMOTO Yoshihiko
Tsukuba Research Center, Electronic System Integration Technology Research Development, Association
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NAKAGAWA Hiroshi
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Tec
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AOYAGI Masahiro
Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Tec
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