TAKAHASHI Kenji | Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
スポンサーリンク
概要
- 同名の論文著者
- Tsukuba Research Center, Electronic System Integration Technology Research Department, Association oの論文著者
関連著者
-
Tomita Yoshihiro
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
-
TAKAHASHI Kenji
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
Umemoto Mitsuo
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
-
TANIDA Kazumasa
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
MORIFUJI Tadahiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
KAJIWARA Ryoichi
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
Tanaka Naotaka
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
-
Tago Masamoto
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
-
TERAO Hiroshi
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
YAMAJI Yasuhiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
HOSHINO Masataka
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
SATO Tomotoshi
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
SUNOHARA Masahiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
AKIYAMA Yukiharu
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
Hoshino Masataka
Association Of Super-advanced Electronic Technologies (aset)
-
BONKOHARA Manabu
Electronics System Integration Technology Research Department, Headquarter Office, Association of Su
-
ANDO Tatsuya
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association o
-
Ando Tatsuya
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
-
Bonkohara Manabu
Electronic System Integration Technology Research Department Association Of Super-advanced Electroni
-
Morifuji Tadahiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), C-B-5, TCI, 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Morifuji Tadahiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Tanaka Naotaka
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Tanida Kazumasa
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Sunohara Masahiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), C-B-5, TCI, 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Takahashi Kenji
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Takahashi Kenji
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), C-B-5, TCI, 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Yamaji Yasuhiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), C-B-5, TCI, 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Tago Masamoto
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Akiyama Yukiharu
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Bonkohara Manabu
Electronic System Integration Technology Research Department, Headquarter Office, Association of Super-Advanced Electronic Technologies (ASET), TIME24 Bldg. 10F, 45, Aomi 2-chome, Koto-ku, Tokyo 135-8073, Japan
-
Hoshino Masataka
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), C-B-5, TCI, 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Terao Hiroshi
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), C-B-5, TCI, 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
-
Tomita Yoshihiro
Tsukuba Research Center, Electronic System Integration Technology Research Department, Association of Super-Advanced Electronic Technologies (ASET), C-B-5, TCI, 1-6, Sengen 2-chome, Tsukuba, Ibaraki 305-0047, Japan
著作論文
- Current Status of Research and Development for Three-Dimensional Chip Stack Technology
- Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20μm Pitch
- Micro Cu Bump Interconnection on 3D Chip Stacking Technology
- Au Bump Interconnection in 20 μm Pitch on 3D Chip Stacking Technology
- Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 μm Pitch
- Current Status of Research and Development for Three-Dimensional Chip Stack Technology