Cu Bump Interconnections in 20 μm-Pitch at Low Temperature Utilizing Electroless Tin-Plating on 3D Stacked LSI
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概要
- 論文の詳細を見る
The electroless tin-plating on copper has the preferable characteristics for the thermal compression bonding, although it is easy to decrease in thickness by heating at the bonding because of the diffusion with copper.Therefore, the bonding profile was determined to have lower pre-heating to evaluate the bondability with copper-bumps dressed thin tin-caps in 20 μm-pitch. Then, the possibility of the interconnections in 20 μm-pitch was confirmed. Bonding temperature was 150°C and bonding force was 24.5 N.Finally, the tin-cap on a through-hole electrode (T-COTE) was performed in the electroless plating and the basic bonding condition was evaluated on the vertical interconnections.The results showed the sufficient joint between the copper electrodes through the Si die and the adjacent copper bumps on the interposer.
- 社団法人 化学工学会の論文
- 2003-02-01
著者
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TAKAHASHI Koji
National Institute of Crop Science
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Tomita Yoshihiro
Tsukuba Research Center Electronic System Integration Technology Research Department Association Of
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TAKAHASHI Kenji
Association of Super-Advanced Electronic Technologies (ASET)
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TOMITA YOSHIHIRO
Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technol
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MORIFUJI TADAHIRO
Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technol
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TOMISAKA MANABU
Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technol
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SUNOHARA MASAHIRO
Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technol
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NEMOTO YOSHIHIKO
Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technol
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SATO TOMOTOSHI
Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technol
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BONKOHARA MANABU
Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technol
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Sato T
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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Bonkohara Manabu
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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Nemoto Yoshihiko
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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Sunohara Masahiro
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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Morifuji Tadahiro
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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Tomita Yoshihiro
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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Tomisaka Manabu
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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Takahashi Kenji
Association Of Super-advanced Electronics Technologies (aset) Electronic System Integration Technolo
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