Application of High Reliable Silicon Thru-Via to Image Sensor CSP
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概要
- 論文の詳細を見る
- 2004-09-15
著者
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Hoshino Masataka
Association Of Super-advanced Electronic Technologies (aset)
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KAMEYAMA Kojiro
Association of Super-Advanced Electronic Technologies (ASET)
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OKAYAMA Yoshio
Association of Super-Advanced Electronic Technologies (ASET)
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UMEMOTO Mitsuo
Association of Super-Advanced Electronic Technologies (ASET)
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SUZUKI Akira
Association of Super-Advanced Electronic Technologies (ASET)
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TERAO Hiroshi
Association of Super-Advanced Electronic Technologies (ASET)
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TAKAHASHI Kenji
Association of Super-Advanced Electronic Technologies (ASET)
関連論文
- Application of High Reliable Silicon Thru-Via to Image Sensor CSP
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- Micro Bump Interconnection Technologies in 20μm Pitch on 3D System in Package