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Samsung Electronics Co. Ltd. Kyungki‐do Kor | 論文
- A Comparison of Poly Silicon and Titanium Polycide for Field Emission Tip
- Enhancement of Mask Selectivity in SiO_2 Etching with a Phase-Controlled Pulsed Inductively Coupled Plasma
- Characteristics of a Stabilized Pulsed Plasma via Suppression of Side-Band Modes
- Control of the Microstructure of (Pb, La) TiO_3 Thin Films by Metal-Organic Chemical Vapor Deposition Using a Solid Delivery System for Ferroelectric Domain Memory
- Optical Property of Pb(Zr, Ti)O_3 Thin Films Deposited on Transparent Substrates by Atmospheric-Pressure Metal-Organic Chemical Vapor Deposition
- The Study on the Reaction Mechanism of HDP-SiOF Film and Inter-Metal-Dielectric Application
- The Study on the Reaction Mechanism of HDP-SiOF Film and Inter-Metal-Dielectric Application
- Diffraction Pattern Functions of a Wedge Composed of Metal and Lossless Dielectric Illuminated by an E-Polarized Plane Wave
- Sintering and Electrical Properties of (CeO_2)_(Gd_2O_3)_ Powders Prepared by Glycine-Nitrate Process for Solid Oxide Fuel Cell Applications
- The Effect of Al/Pt Interface Reaction on Lead-zirconate-titanate Capacitor and the Optimization of Via Contact for Double Metal Ferroelectric RAM
- An Optimized Via Contact Scheme of FeRAM for Double-Level Metallization and Beyond
- Fast EM Evaluation by Highly Accelerated Current Density
- Fast EM Evaluation by Highly Accelerated Current Density
- Fast EM Evaluation by Highly Accelerated Current Density
- Process Design for Preventing the Gate Oxide Thinning in the Integration of Dual Gate Oxide Transistor
- New STI Scheme to Compensate Gate Oxide Thinning at STI Corner Edge for the Devices Using Thick Dual Gate Oxide
- Radial Tilt Detection Using One Beam and Its Cmpensation in a High-Density Read Only Memory
- Effect of SiO_2 Film Deposition on the Ferroelectric Properties of a Pt/Pb(Zr,Ti)O_3/Pt Capacitor
- Effect of ECR CVD SiO_2 Film Deposition of Ferroelectric Properties of Pt/PZT/Pt Capacitor
- Low Damage In Situ Contact Cleaning Method by a Highly Dense and Directional ECR Plasma