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Production Engineering Research Laboratory Hitachi Ltd. | 論文
- Signal Transmission and Coding Architecture for Next-Generation Ethernet(New Technologies in the Internet and their Applications)
- High Reliability Design Method of LC Tuning Circuit and Substantiation of Aging Characteristics for 20 Years (Special Section on Reliability)
- P-IMG-01 Multi-Optical Beam alignment system for Micro-projection(Imaging and Printing Technologies,Technical Program of Poster Session)
- High Pressure Oxygen Treatment and the Substitution of Sr for Ba on (Nd_Ba_)_2(Ce_Nd_)_2Cu_3O_y Superconductor
- Formation of Bi-Pb-Sr-Ca-Cu Oxide Superconducting Layer from Alkoxide Solutions
- Accuracy Improvement of Shot Leveling and Focusing with Interferometry for Optical Lithography
- An Optical Deflector Using Collinear Acoustooptic Coupling Fabricated on Proton-Exchanged LiNbO_3
- Formation of As-Deposited Y-Ba-Cu-O Superconducting Film by a High Temperature Spray Phrolysis Method
- Development of CH_4-Radio-Frequency-Plasma-Enhanced Chemical Vapor Deposition Method with a Positively Self-Biased Electrode for Diamond-Like Carbon Film
- Single Event Effects of Semiconductor Devices at the Ground (特集 シンポジウム「半導体シングルイベント事象の物理と応用」)
- A Method for Making the Shape of Reference Patterns Resemble the Shape of Detected Circuit Patterns
- Detection and Imaging of Subsurface Microcracks in Silicon Wafers Using Photoacoustic Microscope : Photoacoustic Spectroscopy and Ultrasonic Imaging
- One Proposal to the Computing Procedure of CAD Considering a Bolted Joint : Study on the CAD for Machine Tool Structures, Part 2
- Influences of Collared Ribs and Core-Holes on the Static Stiffness of Cylindrical Column : Study on the C.A.D for Machine Tool Structures, Part 1
- System for Inspecting Defects on the Inner Wall of High-aspect-ratio Through-holes in Printed Circuit Boards
- A New Critical Area Simulation Algorithm and Its Application for Failing Bit Analysis
- Trajectory Interpolation of a Robot Hand
- A Behavioral Specification of Imperative Programming Languages
- Progress on 'Kansei' Measurement Technology and Its Application to Visual Inspection
- Particle Detection for Patterned Wafers Using Hybrid Optical-Digital Image Processing : Inspection and Testing