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Ntt Microsystem Integration Laboratories Ntt Corporation | 論文
- Physical Layer OAM&P Signaling Method for 10 Gbit/s Ethernet Transport over Optical Networks(Next Generation Photonic Network Technologies)
- High-Quality Organic 4-Dimethylamino-N-Methyl-4-Stilbazolium Tosylate (DAST) Crystal for Electro-Optic Measurement(Special Issue on Recent Progress in Microwave and Millimeter-wave Photonics Technologies)
- Electro-Optic Measurement Using High-Quality : 4-dimethylamino-N-methyl-4-stilbazolium Tosylate (DAST) Crystal
- High Performance DC Superconducting Quantum Interference Device Utilizing a Bicrystal Junction with a 30° Misorientation Angle
- A1-V Cyclic A/D Converter Using FD-SOI Sample/Hold Circuits for Sensor Networks(Analog, Low-Power LSI and Low-Power IP)
- Polarization splitter and rotator for polarization diversity system in silicon-based micro-photonic circuits (光エレクトロニクス)
- A Low Power Multiplier Using Adiabatic Charging Binary Decision Diagram Circuit
- A 10-Gb/s Burst-Mode Clock-and-Data Recovery IC with Frequency-Adjusting Dual Gated VCOs
- A Low-Voltage 6-GHz-Band CMOS Monolithic LC-Tank VCO Using a Tuning-Range Switching Technique(Special Section on Analog Circuit Techniques Supporting the System LSI Era)
- Suppression of Substrate Crosstalk in Mixed-Signal Complementary MOS Circuits Using High-Resistivity SIMOX(Separation by IMplanted OXygen)Wafers
- Suppression of Substrate Crosstalk in Mixed Analog-Digital CMOS Circuits by Using High-Resistivity SIMOX Wafers
- An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
- Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
- Low-Cost Millimeter-Wave Photonic Techniques for Gigabit/s Wireless Link(Photonic Links for Wireless Communications)(Special Issue on Recent Progress in Microwave and Millimeter-wave Photonics Technologies)
- Gain Improvement of a 2.4-GHz/5-GHz CMOS Low Noise Amplifier by Using High-Resistivity Silicon-on-Insulator Wafers
- Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
- Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
- Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
- RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
- Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology