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NTT Advanced Technology Corporation, NTT Corporation | 論文
- Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
- Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
- Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
- Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
- Integrated RF-MEMS Technology with Wafer-Level Encapsulation
- Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
- Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
- A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing
- A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon
- Microfabrication Technology for Millimeter-Wave Photonic Systems on Si