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Hynix Semiconductor Inc. Kyoungki‐do Kor | 論文
- Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
- Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
- Device Performance Improvement Based on Transient Enhanced Diffusion Suppression in the Deep Sub-Quarter Micron Scale
- Device Performances Improvement Based on TED Suppression in Deep Sub-Quarter Micron Regime
- Sub-100nm Lithographic Performance of Novel Electron Beam Resist
- Sub-100nm Lithographic Performance of Novel Electron Beam Resist
- Sub-100nm Lithographic Performance of Novel Electron Beam Resist
- Chemical junction delineation of a specific site in Si devices
- Analytical electron microscopy study of nanometre-scate oxide formed in contact-hole-bottom Si surfaces
- Novel Approach for the Improvement of Post Exposure Delay Stability in ArF Resist Composed of Alicyclic Polymer
- Preparation and Characterization of High Temperature Perovskite Ferroelectrics in the Solid-Solution (1-x)BiScO_3-xPbTiO_3
- New High Temperature Morphotropic Phase Boundary Piezoelectrics Based on Bi(Me)O_3-PbTiO_3 Ceramics : Electrical Properties of Condensed Matter
- The Effect of Growth Conditions on the Dielectric Properties of Pb(Zn_Nb_)O_3 Single Crystals
- The Role of Processing Variables in the Flux Growth of Lead Zinc Niobate-Lead Titanate Relaxor Ferroelectric Single Crystals
- Transmission Electron Microscopy Study by Chemical Delineation in Si Devices
- Frequency Detuning and Stabilization of a Diode Laser Using the Zeeman Shift of the Saturated Absorption Signal of Rubidium Atoms
- Evolution of Hypervariable Regions, V4 and V7, of Insect 18S rRNA and Their Phylogenetic Implications(Phylogeny)