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Fujitsu Lab. Ltd. | 論文
- Effect of Layout Variation on Stress Migration in Dual Damascene Copper Interconnects
- Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology
- Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation
- Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction
- High Performance Low Temperature Polycrystalline Silicon Thin Film Transistors on Non-alkaline Glass Produced Using Diode Pumped Solid State Continuous Wave Laser Lateral Crystallization
- Observation of Dislocation Motion in Si1-xGex Thin Film on Si Substrate by Laser Scattering Method
- Potential of and Issues with Multiple-Stressor Technology in High-Performance 45 nm Generation Devices
- Selective Single-Crystalline-Silicon Growth at the Pre-defined Active Region of a Thin Film Transistor on Glass by Using Continuous Wave Laser Irradiation
- Self-Aligned Metal Double-Gate Low-Temperature Polycrystalline Silicon Thin-Film Transistors on Non-Alkali Glass Substrate Using Diode-Pumped Solid-State Continuous Wave Laser Lateral Crystallization
- Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity
- Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure
- Electron Spin Resonance of Oxygen-Nitrogen Complex in Silicon
- Effect of Ion Implantation on Dislocation Motion in SiGe/Si Heterostructure
- Effects of Grown-in Hydrogen on Lifetime of Czochralski Silicon Crystals