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Department Of Chemical System Engineering School Of Engineering University Of Tokyo | 論文
- Structure and morphology of self-assembled 3-mercaptopropyltrimethoxysilane layers on silicon oxide.
- Characterization of Amorphous Carbon Films Prepared by Photo-Enhanced Chemical Vapor Deposition at Low Temperatures
- Successful Transcatheter Coil Embolization of Coronary Artery to Left Ventricular Fistula Associated With Absent Pulmonary Valve With Tricuspid Atresia in Early Infancy
- Idiopathic arterial calcification in infancy with twin-twin transfusion syndrome
- Signal Transduction Pathways through TRK-A and TRK-B Receptors in Human Neuroblastoma Cells
- Microstructure Evolution of Iron Carbide during Reaction with Steam at Elevated Temperatures
- Materialographic Investigation on the Mechanism of Hydrogen Production through the Reaction between Iron Carbide and Steam at a Temperature of 673K
- Reduction of Iron Oxides by Nano-Sized Graphite Particles Observed in Pre-Oxidized Iron Carbide at Temperatures around 873K
- Decrease in Deposition Rate and Improvement of Step Coverage by CF_4 Addition to Plasma-Enhanced Chemical Vapor Deposition of Silicon Oxide Films
- Preparation of Low-Dielectric-Constant F-Doped SiO2 Films by Plasma-Enhanced Chemical Vapor Deposition
- Preparation of Low Dielectric Constant F-Doped SiO_2 Films by PECVD
- Effects of substrate heating and biasing on nanostructural evolution of nonepitaxially grown TiN nanofilms.
- Initial growth and texture formation during reactive magnetron sputtering of TiN on Si(111).
- CHARACTERIZATION WITH 3H-HALOPERIDOL OF THE DOPAMINE RECEPTOR IN THE RAT KIDNEY PARTICULATE PREPARATION
- EX VIVO 3H-SPIROPERIDOL BINDING TO RAT STRIATUM AND THE INHIBITORY EFFECTS OF NEUROLEPTICS
- Pressure effect on the absorption and photodissociation of O_2 near the dissociation threshold
- Step Coverage Analysis for Hexamethyldisiloxane and Ozone Atmospheric Pressure Chemical Vapor Deposition
- Age-related profile of neuroblastoma : A comparison of tumors detected by mass-screening with those detected clinically
- TiN Films Prepared by Flow Modulation Chemical Vapor Deposition using TiCl4 and NH3
- Adhesion Characteristics between Chemical Vapor Deposited Cu and TiN Films : Aspects of Process Integration