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Department Of Chemical And Environmental Engineering University Of Arizona | 論文
- Role of Slurry Flow Rate and Solids Content on Critical Tribological and Fluid Dynamics Attributes of ILD CMP
- Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
- Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
- Experimental and Numerical Analysis of An Inhibitor-Containing Slurry for Copper Chemical Mechanical Planarization
- TRIBOLOGY, FLUID DYNAMICS AND REMOVAL RATE CHARACTERIZATION OF NOVEL SLURRIES FOR ILD POLISH APPLICATIONS
- Frictional and Removal Rate Studies of Silicon Dioxide and Silicon Nitride CMP Using Novel Cerium Dioxide Abrasive Slurries
- Dependence of Oxide Pattern Density Variation on Motor Current Endpoint Detection during Shallow Trench Isolation Chemical Mechanical Planarization
- Characterization of Pad–Wafer Contact and Surface Topography in Chemical Mechanical Planarization Using Laser Confocal Microscopy
- Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces
- The Spectral Fingerprints and the Sounds of Chemical Mechanical Planarization Processes
- Analysis of Formation of Pad Stains in Copper Chemical Mechanical Planarization
- Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
- Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process
- Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process
- Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization
- Berberine Inhibits Growth and Induces G1 Arrest and Apoptosis in Human Cholangiocarcinoma QBC939 Cells
- Impact of Wafer Geometry and Thermal History on Pressure and von Mises Stress Non-Uniformity During Chemical Mechanical Planarization
- Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes
- Tribology and Removal Rate Characteristics of Chemical Mechanical Planarization Pads Containing Water Soluble Particles
- Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization