Impact of Wafer Geometry and Thermal History on Pressure and von Mises Stress Non-Uniformity During Chemical Mechanical Planarization
スポンサーリンク
概要
- 論文の詳細を見る
This study employs pressure measurements and von Mises stress simulations across surfaces of wafers in order to examine the effect of wafer-ring gap size, extent and direction of wafer bow, and the effect of thermal history on within wafer pressure non-uniformity (WWPNU). WWPNU analysis for nominally flat, thermally untreated, wafers indicates that the wafer's 'central zone' has average pressure profiles, which remain constant, while the 'edge region' exhibits a sharp pressure peak. Dependence of wafer-ring gap size for the 'central zone' of bowed and thermally untreated wafers on WWPNU indicates that pressure profiles at larger gap sizes remain constant regardless of wafer shape. The 'edge zone' shows that the extent and direction of wafer bow has no effect on average pressure and variability. The effect of wafer-ring gap size on WWPNU for thermally treated wafers indicates that heat treatment reduces, or masks, the effect of gap size on average pressure in the 'central zone' of the wafer. A major effect of thermal treatment is the increase in overall pressure variability at the 'edge zone' of wafers.
- 2003-10-15
著者
-
Beaudoin S.
Department De Chirurgie Pediatrique Hopital Saint-vincent De Paul
-
SOROOSHIAN J.
Department of Chemical and Environmental Engineering, University of Arizona
-
GOLDSTEIN M.
Intel Corporation
-
HUBER W.
Sumitomo Mitsubishi Silicon Group
-
Philipossian A.
Department Of Chemical And Environmental Engineering University Of Arizona
-
Sorooshian J.
Department of Chemical and Environmental Engineering, University of Arizona, Tucson, Arizona 85721, USA
-
Goldstein M.
Intel Corporation, Santa Clara, California 95052, USA
-
Philipossian A.
Department of Chemical and Environmental Engineering, University of Arizona, Tucson, Arizona 85721, USA
-
Beaudoin S.
Department of Chemical and Materials Engineering, Arizona State University, Tempe, Arizona 85287, USA
関連論文
- Familial malrotation : report of three affected siblings
- Impact of Wafer Geometry and Thermal History on Pressure and von Mises Stress Non-Uniformity During Chemical Mechanical Planarization
- Impact of Wafer Geometry and Thermal History on Pressure and von Mises Stress Non-Uniformity During Chemical Mechanical Planarization
- Tribology and Removal Rate Characteristics of Chemical Mechanical Planarization Pads Containing Water Soluble Particles