Impact of Wafer Geometry and Thermal History on Pressure and von Mises Stress Non-Uniformity During Chemical Mechanical Planarization
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-10-15
著者
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Beaudoin S.
Department De Chirurgie Pediatrique Hopital Saint-vincent De Paul
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Beaudoin S.
Department Of Chemical And Materials Engineering Arizona State University
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SOROOSHIAN J.
Department of Chemical and Environmental Engineering, University of Arizona
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PHILIPOSSIAN A.
Department of Chemical and Environmental Engineering, University of Arizona
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GOLDSTEIN M.
Intel Corporation
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HUBER W.
Sumitomo Mitsubishi Silicon Group
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- Impact of Wafer Geometry and Thermal History on Pressure and von Mises Stress Non-Uniformity During Chemical Mechanical Planarization
- Impact of Wafer Geometry and Thermal History on Pressure and von Mises Stress Non-Uniformity During Chemical Mechanical Planarization