Lee S. | Semiconductor Advanced Research Div. Hyundai Electronics Industries Co.

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著作論文

A Technology for Suppressing Inter-Layer Dielectric Crack in a High Density DRAM
Inter-Layer Dielectric Reliability on 1GDRAM with COB Structure
Current Development Status and Future Challenge of FeRAM Technologies
Vacuum Bonding for the Fabrication of PBSOI
Elimination of Al Line and Via Resistance Degradation under HTS Test in the Application of F-Doped Oxide as Intermetal Dielectrics
The Device Degradation Due to Contamination from STI Filling Material
Low Damage In-Situ Contact Cleaning Method by a Highly Dense and Directional ECR Plasma
High Performance Buried Channel-pFETs Using Elevated Source/Drain Structure with Self-Aligned Epitaxial Silicon Sliver (SESS)
THE INFLUENCE OF INTEGRATION PROCESS ON THE IMPRINT IN PT-PZT-PT FERROELECTRIC CAPACITORS

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