KAWABATA Akio | Fujitsu Limited

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著作論文

Carbon Nanotube Growth Technologies Using Tantalum Barrier Layer for Future ULSIs with Cu/Low-k Interconnect Processes
Electrical Properties of Carbon Nanotube Bundles for Future Via Interconnects
Influence of Growth Mode of Carbon Nanotubes on Physical Properties for Multiwalled Carbon Nanotube Films Grown by Catalystic Chemical Vapor Deposition
Carbon nanotube technologies for future ULSI via interconnects
Mechanical Polishing Technique for Carbon Nanotube Interconnects in ULSIs
Simultaneous Formation of Multiwall Carbon Nanotubes and their End-Bonded Ohmic Contacts to Ti Electrodes for Future ULSI Interconnects
Carbon Nanotube Growth Technologies Using Tantalum Barrier Layer for Future ULSIs with Cu/Low-$k$ Interconnect Processes
Simultaneous Formation of Multiwall Carbon Nanotubes and their End-Bonded Ohmic Contacts to Ti Electrodes for Future ULSI Interconnects
Mechanical Polishing Technique for Carbon Nanotube Interconnects in ULSIs

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