KANEMOTO Kei | Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
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概要
- KANEMOTO Keiの詳細を見る
- 同名の論文著者
- Department of Electronic Engineering, Graduate School of Engineering, Tohoku Universityの論文著者
関連著者
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KANEMOTO Kei
Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
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Kanemoto Kei
Department Of Electronic Engineering Graduate School Of Engineering Tohoku University
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Nakada A
Vlsi Design And Education Center The University Of Tokyo
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Ohmi Tadahiro
Department Of Electronic Engineering Graduate School Of Engineering Tohoku University
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NAKADA Akira
Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
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Ohmi Tadahiro
Department Of Electronic Engineering
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AHARONI Herzl
New Industry Creation Hatchery Center, Tohoku University
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Aharoni Herzl
東北大学未来科学技術共同研究センター
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Ohmi T
Tohoku Univ. Sendai Jpn
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Aharoni Herzl
New Industry Creation Hatchery Center Tohoku University
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Ohmi Tadahiro
New Industry Creation Hatchery Center (niche) Tohoku University
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OHMI Tadahiro
New Industry Creation Hatchery Center, Tohoku University
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OKA Mauricio
Department of Electronic Engineering, Faculty of Engineering, Tohoku University
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TAMAI Yukio
Department of Electronic Engineering, Faculty of Engineering, Tohoku University
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Oka Maurichio
Department Of Electronic Engineering Faculty Of Engineering Tohoku University
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Ohmi Tadahiro
New Industry Creation Hatchery Center Future Information Industry Creation Center Tohoku University
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Tamai Yukio
Department Of Electronic Engineering Faculty Of Engineering Tohoku University
著作論文
- Minimization of BF^+_2-Implantation Dose to Reduce the Annealing Time for Ultra-Shallow Source/Drain Junction Formation below 600℃
- Reduction of BF2+-Implantation Dose to Minimize the Annealing Time for Ultra-Shallow Source/Drain Junction Formation below 600℃
- Formation of Ultra-Shallow and Low-Leakage p^+n Junctions by Low-Temperature Post-Implantation Annealing
- Ultrashallow and Low-Leakage p^+n Junction Formation by Plasma Immersion Ion Implantation (PIII) and Low-Temperature Post-Implantation Annealing
- Ultra-Shallow and Low-Leakage p^+n Junctions Formation by Plasma Immersion Ion Implantation (PIII) and Low-Temperature Post-Implantation Annealing