Influence of the UV cure on advanced plasma enhanced chemical vapour deposition low-k materials (Special issue: Advanced metallization for ULSI applications)
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概要
著者
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Verdonck Patrick
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
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Roest David
ASM, Kapeldreef 75, B-3001 Leuven, Belgium
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Baklanov Mikhail
imec, Kapeldreef 75, B-3001 Leuven, Belgium
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Besien Els
imec, Kapeldreef 75, 3001 Heverlee, Belgium
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Vanstreels Kris
imec, Kapeldreef 75, 3001 Heverlee, Belgium
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Trompoukis Christos
imec, Kapeldreef 75, 3001 Heverlee, Belgium
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Urbanowicz Adam
imec, Kapeldreef 75, 3001 Heverlee, Belgium
関連論文
- Influence of the UV cure on advanced plasma enhanced chemical vapour deposition low-k materials (Special issue: Advanced metallization for ULSI applications)
- Advanced Organic Polymer for the Aggressive Scaling of Low-$k$ Materials
- Dielectric Reliability of 50 nm Half Pitch Structures in Aurora\textregistered LK
- Integration of Porogen-Based Low-$k$ Films: Influence of Capping Layer Thickness and Long Thermal Anneals on Low-$k$ Damage and Reliability
- Impact of Hydrocarbon Control in Ultraviolet-Assisted Restoration Process for Extremely Porous Plasma Enhanced Chemical Vapor Deposition SiOCH Films with k = 2.0 (Special Issue : Advanced Metallization for ULSI Applications)