Improved step coverage of Cu seed layers by magnetic-field-assisted lonized sputtering (Special issue: Advanced metallization for ULSI applications)
スポンサーリンク
概要
著者
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Suu Koukou
Institute for Semiconductor and Electronics Technologies, ULVAC Inc., Susono, Shizuoka 410-1231, Japan
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Kodaira Shuji
Institute of Semiconductor and Electronics Technologies, ULVAC, Inc., Susono, Shizuoka 410-1231, Japan
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Sakamoto Yuta
Institute of Semiconductor and Electronics Technologies, ULVAC Inc., 1220-1 Suyama, Susono, Shizuoka 410-1231, Japan
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Kamada Koukichi
Institute of Semiconductor and Electronics Technologies, ULVAC Inc., 1220-1 Suyama, Susono, Shizuoka 410-1231, Japan
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Hamaguchi Junichi
Institute of Semiconductor and Electronics Technologies, ULVAC Inc., 1220-1 Suyama, Susono, Shizuoka 410-1231, Japan
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Sano Akifumi
Institute of Semiconductor and Electronics Technologies, ULVAC Inc., 1220-1 Suyama, Susono, Shizuoka 410-1231, Japan
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Numata Yukinobu
Institute of Semiconductor and Electronics Technologies, ULVAC Inc., 1220-1 Suyama, Susono, Shizuoka 410-1231, Japan
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Toyoda Satoru
Institute of Semiconductor and Electronics Technologies, ULVAC Inc., 1220-1 Suyama, Susono, Shizuoka 410-1231, Japan
関連論文
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- Improved step coverage of Cu seed layers by magnetic-field-assisted lonized sputtering (Special issue: Advanced metallization for ULSI applications)
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