Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-05-20
著者
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Oh Tae-sung
Department Of Metallurgical Engineering And Materials Science Hong-ik University
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Oh Tae-sung
Department Of Materials Science And Engineering Hongik University
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Jun Sung-woo
Department Of Materials Science And Engineering Hongik University
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KIM Young-Ho
Department of Mechanical Engineering, Hanyang University
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Kim Young-ho
Department Of Materials Science And Engineering Hanyang University
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Choi Jae-Hoon
Department of Electrical and Computer Engineering, Hanyang University, Korea
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Choi Jae-hoon
Department Of Materials Science And Engineering Hongik University
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LEE Kwang-Yong
Department of Materials Science and Engineering, Hongik University
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Choi Jae-hoon
Department Of Electrical And Computer Engineering Hanyang University Korea
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Lee Kwang-yong
Department Of Materials Science And Engineering Hongik University
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Kim Young-ho
Department Of Materials Engineering Hanyang University
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Oh Tae-sung
Department Of Cellular And Structural Biology The University Of Texas Health Science Center At San A
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Kim Young-Ho
Department of Advanced Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea
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