Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin
スポンサーリンク
概要
- 論文の詳細を見る
- 2012-10-01
著者
-
Kim Min-young
Department Of Materials Science And Engineering Hongik University
-
Oh Tae-sung
Department Of Cellular And Structural Biology The University Of Texas Health Science Center At San A
-
OH Tae-Sung
Department of Materials Science and Engineering, Hongik University
-
KIM Sung-Kyu
Department of Materials Science and Engineering, Hongik University
関連論文
- Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys
- Pectolinarin and Pectolinarigenin of Cirsium setidens Prevent the Hepatic Injury in Rats Caused by D-Galactosamine via an Antioxidant Mechanism(Pharmacognosy)
- Thermoelectric Characteristics of the Thermopile Sensors with Variations of the Width and the Thickness of the Electrodeposited Bismuth-Telluride and Antimony-Telluride Thin Films
- Electrical Characteristics of the Pt/SrBi_Ta_2O_9/ZrO_2/Si Structure for Metal-Ferroelectric-Insulator-Semiconductor Field-Effect-Transistor Application
- Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint
- Prediction of Effective Thermal Diffusivity of Fish and Meats
- Inhibition of the Androgen Receptor Function by Triplex-Forming Oligonucleotides
- Association between Short Sleep Duration and High Incidence of Metabolic Syndrome in Midlife Women
- Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin
- Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding
- Thermoelectric Characteristics of n-Type Bi_2Te_3 and p-Type Sb_2Te_3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications