Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding
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概要
- 論文の詳細を見る
- 2012-12-01
著者
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Kim Min-young
Department Of Materials Science And Engineering Hongik University
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Oh Tae-sung
Department Of Cellular And Structural Biology The University Of Texas Health Science Center At San A
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OH Tae-Sung
Department of Materials Science and Engineering, Hongik University
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