Pt/Ti Thin Film Adhesion on SiN_x/Si Substrates
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概要
- 論文の詳細を見る
The adhesion of Pt/Ti thin films on SiN_x/Si substrates with respect to the substrate pretreatment and annealing ambient was investigated using the adhesive tape test, the peel test, and the scratch test. Pt/Ti thin films were deposited a DC magnetron sputtering system. The in situ Ar^+ RF plasma treatment was more effective in enhancing adhesion between the Pt/Ti thin films and the SiN_x/Si substrate than chemical cleaning. After annealing in an oxygen ambient, the adhesion of the Pt/Ti/SiN_x/Si specimen was degraded. This adhesion degradation was attributed to the depletion of the Ti adhesion layer due to the formation of the rutile TiO_2 phase.
- 社団法人応用物理学会の論文
- 1999-07-15
著者
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Kim Young-ho
Department Of Materials Engineering Hanyang University
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Kang Unbyoung
Department of Materials Engineering, Hanyang University
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Lee Taegon
Package Technology Team, Samsung Electro-Mechanics Co., Ltd.
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Lee Taegon
Package Technology Team Samsung Electro-mechanics Co. Ltd.
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Kang Unbyoung
Department Of Materials Engineering Hanyang University
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Kim Young-Ho
Department of Advanced Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea
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