Copper Plating Method on Flat Surface for High Frequency Signal Transfer
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概要
- 論文の詳細を見る
A copper plating process for printed wiring boards operating in the GHz frequency range has been developed that improves the adhesion strength between the copper interconnects and the resin substrate by using an imidazole compound to form coordinate bonds. The coordinate bonds are prepared by impregnating the resin substrate with an aqueous solution of amino-group-containing imidazole (AI). The adhesion strength is measured by a tensile test with various concentrations of AI solution and different treatment times of impregnation. As a result, the highest adhesion strength of 4.2–5.1 N$\cdot$cm-1 can be obtained on the entire surface of a $340\times 340$ mm2 substrate, where the flatness is down to 58.7 nm. This result is due to the optimization of the impregnating condition for AI and of the removal condition for weak boundary layers. The signal transmission characteristics of the interconnects on the substrates fabricated by this processes are compared with the conventional process by $S_{21}$ parameter extraction in the GHz frequency range. The transmission characteristics of this process are markedly improved compared with those of conventional processes.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-09-15
著者
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Sugimura Masahiko
Research And Development Center Zeon Corporation
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Nakada Akira
Graduate School Of Science And Technology Kumamoto University
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Kubota Hiroshi
Graduate School Of Science And Technology Kumamoto University
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Wakizaka Yasuhiro
Research & Development Center, Zeon Corp., 1-2-1 Yako, Kawasaki-ku, Kawasaki 210-9507, Japan
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Hontake Koichi
Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555, Japan
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Furuya Akihiko
Electronics Research Laboratory, Toppan Printing Co., Ltd., 4-2-3 Takanodaiminami, Sugito-machi, Saitama 345-8508, Japan
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Uchida Daisuke
Research & Development Center, Zeon Corp., 1-2-1 Yako, Kawasaki-ku, Kawasaki 210-9507, Japan
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Kuribayashi Koichiro
Technical Development Section, Technical Division, Ogata Industrial Co., Ltd., 2-9-9 Kamikumamoto, Kumamoto 860-0079, Japan
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Noda Tomoko
Engineering Section, Kumamoto Bosei Kogyo Co., Ltd., 1-4-15 Nagaminenishi, Kumamoto 862-0937, Japan
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Chikuma Mitsuyasu
Technical Support Group, Tokyo Sales Dept., C. Uyemura Co., Ltd., 1-1-2 Torigoe, Taito-ku, Tokyo 111-0054, Japan
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Toki Sotaro
Electronics Research Laboratory, Toppan Printing Co., Ltd., 4-2-3 Takanodaiminami, Sugito-machi, Saitama 345-8508, Japan
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Sasaki Jun
Electronics Research Laboratory, Toppan Printing Co., Ltd., 4-2-3 Takanodaiminami, Sugito-machi, Saitama 345-8508, Japan
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Hagiwara Muneaki
Kumamoto Technology and Industry Foundation, 2081-10 Tabaru, Mashiki-machi, Kumamoto 861-2202, Japan
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Uchida Daisuke
Research & Development Center, Zeon Corp., 1-2-1 Yako, Kawasaki-ku, Kawasaki 210-9507, Japan
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Sugimura Masahiko
Research & Development Center, Zeon Corp., 1-2-1 Yako, Kawasaki-ku, Kawasaki 210-9507, Japan
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