Deposition of Cu and Ru Thin Films in Deep Nanotrenches/Holes Using Supercritical Carbon Dioxide
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概要
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Supercritical CO2 behaves like both a gas and a liquid, and posseses unique features such as nanopenetration capability, high diffusivity, and solvent ability. The technique described in this paper uses the supercritical CO2 as a reaction medium for thin film growth and realizes filling or coating of nanofeatures with conducting metals. In this paper, we demonstrate the possibilities of this technique in Cu and Ru thin film deposition. A basic approach to achieving Cu metallization of deca-nanometer trenches or vias were studied. Ru, a promising material for capacitor electrodes and also a new candidate for the next-generation Cu barrier, was successfully deposited and its deposition characteristics were studied. Filling capability and the possibility of conformal deposition were also demonstrated as well as the fabrication of a Cu$\backslash$Ru stack.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-06-15
著者
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KONDOH Eiichi
Interdisciplinary Graduate School of Medicine and Engineering Department of Mechanical System Engine
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Kondoh Eiichi
Interdisciplinary Graduate School of Medicine and Engineering, Department of Mechanical System Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu 400-8511, Japan
関連論文
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- Deposition of Cu and Ru Thin Films in Deep Nanotrenches/Holes Using Supercritical Carbon Dioxide
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- Resonance Properties of Surface Acoustic Wave Resonator in Supercritical CO2
- Conformal Copper Coating of True Three-Dimensional Through-Holes Using Supercritical Carbon Dioxide
- Room-Temperature Formation of a ZnO-Based Adhesion Layer for Nanoprecision Cu/Glass Metallization
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- Deposition of Cu and Ru Thin Films in Deep Nanotrenches/Holes Using Supercritical Carbon Dioxide