Conformal Copper Coating of True Three-Dimensional Through-Holes Using Supercritical Carbon Dioxide
スポンサーリンク
概要
- 論文の詳細を見る
Copper thin films were deposited inside true three-dimensional, high aspect ratio, and complex shaped through-holes that were formed in glass substrates. The deposition was carried out in a supercritical carbon dioxide solution from a copper complex via hydrogen reduction. The conformal thin films were successfully deposited on the sidewalls of straight, crank-shaped, and Y-shaped through-holes. The coating length increased with decreasing the deposition temperature. Numerical simulations suggested an importance of the presence of a fluid motion in the through-holes.
- 2012-05-25
著者
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KONDOH Eiichi
Interdisciplinary Graduate School of Medicine and Engineering Department of Mechanical System Engine
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Watanabe Mitsuhiro
Interdisciplinary Graduate School of Medicine and Engineering, University of Yamanashi, Kofu 400-8511, Japan
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Takeuchi Yuto
Interdisciplinary of Graduate School of Medicine and Engineering, University of Yamanashi, Kofu 400-8511, Japan
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Ueno Takahiro
Interdisciplinary of Graduate School of Medicine and Engineering, University of Yamanashi, Kofu 400-8511, Japan
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Matsubara Masahiro
Interdisciplinary of Graduate School of Medicine and Engineering, University of Yamanashi, Kofu 400-8511, Japan
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Yamamoto Satoshi
Electron Device Laboratory, Fujikura Ltd., Sakura, Chiba 285-8550, Japan
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Kikukawa Naohiro
Electron Device Laboratory, Fujikura Ltd., Sakura, Chiba 285-8550, Japan
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Suemasu Tatsuo
Electron Device Laboratory, Fujikura Ltd., Sakura, Chiba 285-8550, Japan
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