Scanning Removal of Ion-implanted Novolak Resist by using a Laser Irradiation
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概要
- 論文の詳細を見る
Laser resist stripping for the ion-implanted novolak resist was successfully performed without occurring laser damage to the Si wafer. In order for the advanced laser resist stripping method to be successful, it is important for the pulsed laser beam to pass though the ion-implanted resist and absorb into the Si wafer surface. The novolak resists which are implanted with B, P, and As ions, respectively, were irradiated with a pulsed 532nm laser. Regardless of the implanted ion species and density, more than 74 % of the laser power was found to absorb into the Si wafer surface. For the laser irradiation of 1 pulse, the ion-implanted resist with a density of 5.0 X 1013 atoms/cm2 was completely stripped in the same way as that of a non-implanted resist. The optical absorption of the resist surface increased as the density of the ion-implantation increased. In case of the ion-implanted resist with a density of 5.0 X 1015 atoms/cm2, the resist was stripped by 20 pulses irradiation without occurring laser-induced surface damage. A scanning removal of the highly ion-implanted resist was also successfully stripped by using an optimized irradiation condition. A highly ion-implanted resist was continuously stripped by the scanning laser irradiation with 20 pulses.
- The Society of Photopolymer Science and Technology (SPST)の論文
著者
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Muraoka Hiroki
Department Of Applied Chemistry Faculty Of Science And Engineering Kinki University
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Harada Toshiyuki
Department Of Biomolecular Science Faculty Of Engineering Gifu University
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Kamimura Tomosumi
Department of Electronics Information and Communication Engineering, Osaka Institute of Technology, 5-16-1 Omiya Asahiku, Osaka, Osaka 535-8585, Japan
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NISHIYAMA Takashi
Department of Aeronautics and Astronautics, Faculty of Engineering, Kyushu University
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Nishiyama Takashi
Department of Applied Chemistry and Bioengineering, Graduate School of Engineering, Osaka City University
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Kuramae Hiroyuki
Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology,
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Horibe Hideo
Department of Applied Chemistry and Bioengineering, Graduate School of Engineering, Osaka City University
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Kiriyama Takuya
Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology,
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Kuroki Yuta
Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology,
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