PS50 切削原理を利用した界面強度評価(フェロー賞対象ポスターセッション)

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The purpose of this paper is to develop the evaluation method of interfacial strengths with a micro cutting system. The interfacial strength of thin films is crucial for the reliability assessment of electronics packages and MEMS devices. There have been a lot of experimental and theoretical studies about the measurement of interfacial strengths. However, it is still under developing stages, because it is quite difficult to measure it quantitatively for micro- and nano-thickness films. Recently, SAICAS(Surface and Interfacial Cutting Analysis System) has been developed and used for the evaluation of the mechanical properties in micro- and nano-thickness films. In this paper, we carried out the numerical simulation of SAICAS micro cutting tests by Multibody dynamics with HyperWorks and analyzed the behavior of peeled film.
2010-10-09