D17 サファイアの微細切削(OS14 先端材料・難削材の加工(3))

概要

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Micro cuttings of sapphire are presented to finish crack-free surfaces in scratching and milling. The indentation tests were conducted to measure the critical stress, at which cracks initiate and propagate in subsurface. Then, the cutting processes of r crystal plane are discussed with measuring the cutting forces and observing the surface finishes. The cutting process depends on the cutting direction for r crystal plane and anisotropy is observed in the critical depth of cut for finishing crack-free surface. The critical depth in the cutting direction toward a-axis is much larger than that of perpendicular cutting direction. The surface finishes on a, c and r planes are compared in milling with the inclined cutter at 45 deg in the feed direction. Although the surface finish on r crystal plane is better than other planes, the removed chip is adhered on the surface in cutting with the water supply. The surface finished is improved in milling with lubrication.
2010-11-19