F02(2) 電子機器冷却の課題と展望(【F02】熱工学最前線)

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This paper describes one of the new package cooling technology concept using a phase changing material (PCM) which would help develop high-density packaging and the development of a self-cooling system utilizing waste heat from electronic equipment In the former study, a low cost alloy, composed of Bi/Pb/Sn/In in which melting points of individual elements are less than 373 Kelvin, was used as the PCM In the latter, the feasibility of a self-cooling mechanism was investigated, in which refrigerant in a sealed container is heated by waste heat, a turbine is rotated by the vapor generated, and the rotational force is extracted using a magnetic coupling, which in turn is used to rotate a cooling fan. In this study, a system was prototyped and performance tests carried out to characterize its performance.
2007-09-07