Proposal of New Bonding Technique "Instantaneous Liquid Phase (ILP) Bonding"(Physics, Process & Instrument)
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概要
- 論文の詳細を見る
A new bonding technique named "Instantaneous Liquid Phase (ILP) bonding" suitable mainly for welding dissimilar materials was proposed by which instantaneous melting of one or two of the faying surfaces is utilized. The processes of ILP bonding are mainly consisted of three stages, namely the first stage forming thin liquid layer by rapid heating, the second stage joining both specimens by thin liquid layer, and the third stage cooling the specimens rapidly to avoid the formation of brittle layer. The welding temperatures of the specimens to be welded in ILP bonding are generally differentiated from each other. ILP bonding was applied for a variety of combinations of dissimilar materials of aluminum, aluminum alloys, titanium, titanium alloy, carbon steel, austenitic stainless steel, copper and tungsten, and for similar materials of stainless steel and nickel-base alloy. There were no microvoids in these welding joints, and the formation of brittle layer at the bonding interface was suppressed. The welded joints of Al+Ti, Cu+carbon steel and Cu+austenitic stainless steel showed the fracture in base metal having lower tensile strength. Further, the welded joints of Al+carbon steel, Al alloy+Ti, Al alloy+carbon steel or+austenitic stainless steel, Ti+carbon steel or+austenitic stainless steel showed better tensile properties in the comparison with diffusion welding. Furthermore, ILP bonding was available for welding same materials susceptible to hot cracking. Because of the existence of liquid layer, the welding pressure required was extremely low, and preparation of faying surface by simple tooling or polishing by #80 emery paper was enough. The change in specimen length before and after welding was relatively little, only depending on the thickness of liquid layer. The welding time was very short, and thus high welding efficiency was obtained.
- 大阪大学の論文
著者
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MATSUDA Fukuhisa
Osaka University
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NAKAGAWA Hiroji
Osaka University
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Zhang Y‐c
Osaka Univ. Osaka Jpn
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Zhang Yue-chang
Osaka University:shanghai Jiao Tong Univ.
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Matsuda F
Osaka University
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Nakagawa H
Osaka Univ. Jpn
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Zhang Yue-chang
Osaka University
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Matsuda Fukuhisa
Osaka Univ.
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