Microtrench Generation in SiO_2 Trench Etching for Damascene Interconnection Process
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2002-09-15
著者
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Yoshida Yuichi
Division Of Electrical Electronic And Information Engineering Graduate School Of Engineering Osaka U
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YAMAUCHI Takeshi
Corporate Manufacturing Engineering Center, TOSHIBA Corporation
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Yamauchi Takeshi
Corporate Manufacturing Engineering Center Toshiba Corporation
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Seki Satoru
Department Of Applied Physics Tokai University
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Yamauchi T
Corporate Manufacturing Engineering Center Toshiba Corporation
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SETA Shoji
Telecom System LSI DepartmentI Network & Telecom System LSI Division, Toshiba Corporation
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SEKINE Makoto
Advanced ULSI Process Engineering Department, Process & Manufacturing Engineering Center, Toshiba Co
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HAYASHI Hisataka
Advanced ULSI Process Engineering Department, Process & Manufacturing Engineering Center, Toshiba Co
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YOSHIDA Yukimasa
Advanced ULSI Process Engineering Department, Process & Manufacturing Engineering Center, Toshiba Co
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Seta Shoji
Telecom System Lsi Departmenti Network & Telecom System Lsi Division Toshiba Corporation
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Hayashi H
Advanced Ulsi Process Engineering Department Process & Manufacturing Engineering Center Toshiba
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Sekine Makoto
Advanced Ulsi Process Engineering Department Process & Manufacturing Engineering Center Toshiba
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Hayashi Hisataka
Advanced Ulsi Process Engineering Department Process & Manufacturing Engineering Center Toshiba
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Yoshida Yukimasa
Advanced Ulsi Process Engineering Department Process & Manufacturing Engineering Center Toshiba
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